Joining Technology in Electronics

Rework soldering of SMT components SMT 3

Compared to through-hole technology, rework and repair of SMT assemblies require a significantly greater investment in specialized tools and personnel training due to the wide variety of housings. This course familiarizes participants with the latest tools and devices in the field of SMT repair. Participants also learn a number of different repair techniques.

Main topics covered

  • Basic procedure for carrying out rework or repairs
  • Overview of individual methods
  • Replacing components using suitable methods based on practical procedural guidelines for part sizes 01005 to BGA
  • Assessment of soldered joint quality according to the standards J-STD-001, IPC-A-610 and EN 61191

 

Course details

Dates:
June 20-23, 2016
Nov 28 - Dec 1, 2016

No. of participants:
approx. 12 participants

Course fee:
€ 1,270